Digi XBee3™ modules accelerate time to market for designers, OEMs and solution providers by quickly enabling wireless connectivity and easy-to-add functionality. Building on industry-leading technology, pre-certified Digi XBee3 modules offer the flexibility to switch between multiple frequencies and wireless protocols as needed.
Specifications
Specifications
TRANSCEIVER CHIPSETSilicon Labs EFR32MG SoC
DATA RATERF 250 Kbps, Serial up to 1 Mbps
INDOOR/URBAN RANGE200 ft (60 m)
OUTDOOR/RF LINE-OF-SIGHT RANGE4000 ft (1200 m)
TRANSMIT POWER+8 dBm
RECEIVER SENSITIVITY (1% PER)-103 dBm Normal Mode
SERIAL DATA INTERFACEUART, SPI, I2C
CONFIGURATION METHODAPI or AT commands, local or over-the-air (OTA)
DIMENSIONS (L X W X H)Through-Hole: 0.960 x 1.087 in (2.438 x 2.761 cm)
SMT: 0.866 x 1.33 x 0.120 in (2.199 x 3.4 x 0.305 cm)
Micro: 0.533 x 0.76 x 0.087 in (13 x 19 x 2 mm)
MEMORY1 MB / 128 KB RAM
CPU/CLOCK SPEEDHCS08 / up to 50.33 MHz
PROTOCOLZigbee® 3.0
ENCRYPTION128/256 bit AES
RELIABLE PACKET DELIVERYRetries/Acknowledgements
IDSPAN ID and addresses, cluster IDs and endpoints (optional)